Description

The 2.0 mm desoldering braid is an essential tool for the efficient removal of electronic components soldered onto printed circuit boards, designed to facilitate desoldering without the use of flux. Made from high-quality conductive materials, it ensures capillary absorption of molten solder, allowing for a clean and precise operation, ideal for repair and maintenance work on electronic boards. This product stands out for its ability to quickly and residue-free remove solder material, minimising the risk of damage to surrounding components and the circuit itself. Its 2.0 mm width is optimal for operations on standard-sized tracks, offering the perfect balance between efficiency and control during the desoldering process.

Technical documents

External diameter	2.00 mm
External length	2.00 mm
Thickness	2.00 mm
Flow soldering packaging	treccia
Gross weight	0.01 kg
Lead time in order confirmations	Disponibile dalla settimana 2
Net weight	0.01 kg
Percentage of silver	0
Copper percentage	0
Percentage of tin	0
tipologia_confezione	rocchetto
tipologia_lega	NA
Wire diameter (mm)	2 mm
Weight (g)	NA (Not applicable)

2.0mm desoldering braid

Description

Technical documents

Diventa cliente