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Description

The 3.0 mm desoldering braid is an essential tool for the precise and clean removal of electronic components soldered onto printed circuit boards. This product allows desoldering without the use of flux, thereby reducing the risk of contamination and enabling a safer and more controlled intervention during circuit repair or modification operations. Made from high-quality materials, the braid ensures effective absorption of solder alloy, guaranteeing a quick and accurate cleaning of tracks and pads without damaging them. The 3.0 mm width makes it suitable for various professional applications, offering an optimal balance between precision and solder removal capacity.

Technical documents

External diameter 3.00 mm
External length 3.00 mm
Thickness 3.00 mm
Flow soldering packaging treccia
Gross weight 0.01 kg
Lead time in order confirmations Disponibile dalla settimana 38
Net weight 0.01 kg
Percentage of silver 0
Copper percentage 0
Percentage of tin 0
Tipologia confezione Rocchetto
Tipologia lega NA
Wire diameter (mm) 3 mm
Weight (g) NA (Not applicable)
SIAE 0

Properties

SIAE: 0
Frame 17 (1)
Frame 18 (1)
Frame 19 (1)
Frame 20 (1)
Frame 21 (1)

Diventa cliente

Melchioni Ready offre una gamma di prodotti di qualità, nessun minimo ordinabile e un supporto tecnico commerciale altamente qualificato

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