Description

Tin in cardboard with a composition of 60% tin and 40% lead, specifically designed for professional soldering applications. The product incorporates a flux with three cores of RS 3 type resin, ensuring excellent cleaning and adhesion during the soldering process. The melting range is between 183 and 188 °C, providing controlled and uniform melting, in accordance with ASTM-B32 standard. This material is ideal for electronic and mechanical assembly operations, offering thermal stability and reliability in soldered joints. The cardboard form facilitates handling and precise application of the solder wire, making it an efficient tool for professionals who require quality and consistency in their work.

Technical documents

External diameter	1.50 mm
Thickness	1.50 mm
Flow soldering packaging	cartoncino
Gross weight	0.03 kg
Net weight	0.03 kg
Percentage of silver	0
Copper percentage	0
Percentage of tin	60
tipologia_confezione	cartoncino
tipologia_lega	Sn/Pb+
Wire diameter (mm)	1,5 mm
Weight (g)	25 gr

60/40 Cardboard Solder 1.5mm 25g

Description

Technical documents

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