Description

Lead-free solder wire on a spool with an Sn/Cu alloy composition of 99/1, specifically designed for professional soldering applications requiring lead-free materials. The product features a diameter of 1.0 mm and a weight of 500 grams, ensuring good handling and durability during soldering operations. The Sn/Cu alloy provides excellent mechanical properties and good electrical conductivity, making it ideal for electronic assembly work and repairs. The spool packaging facilitates continuous use and wire control during the soldering process, enhancing efficiency and precision. This solder is particularly suitable for sectors requiring compliance with environmental and safety regulations, thanks to its lead-free formulation that reduces toxic impact and improves workplace health conditions.

Technical documents

External diameter	1.00 mm
External Height	54.30 mm
External length	52.50 mm
Thickness	1.00 mm
External Width	52.50 mm
Flow soldering packaging	rocchetto
Gross weight	0.51 kg
Net weight	0.50 kg
Percentage of silver	0
Copper percentage	1
Percentage of tin	0
tipologia_confezione	rocchetto
tipologia_lega	Sn/Cu
Wire diameter (mm)	1 mm
Weight (g)	500 gr

Lead-free solder spool LEAD FREE 99/1 1.0mm 500g

Description

Technical documents

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