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Description

The LEAD FREE 99/1 solder wire is a lead-free alloy composed of 99% tin (Sn) and 1% copper (Cu). This material is specifically designed for soldering applications requiring a lead-free composition, ensuring compliance with environmental and safety regulations. The wire diameter is 1.0 mm, an ideal size for precision work in electronics and components. The product is packaged on a 100-gram spool, facilitating continuous and controlled use during soldering operations. Thanks to its composition and format, this solder offers excellent flow and adhesion properties, ensuring strong, high-quality joints in professional settings.

Technical documents

External diameter 1.00 mm
External Height 19.40 mm
External length 50.00 mm
Thickness 1.00 mm
External Width 50.00 mm
Flow soldering packaging rocchetto
Gross weight 0.11 kg
Lead time in order confirmations Disponibile dalla settimana 49
Net weight 0.10 kg
Percentage of silver 0
Copper percentage 1
Percentage of tin 0
tipologia_confezione rocchetto
tipologia_lega Sn/Cu
Wire diameter (mm) 1 mm
Weight (g) 100 gr
Frame 17 (1)
Frame 18 (1)
Frame 19 (1)
Frame 20 (1)
Frame 21 (1)

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